2 years Postdoc – Investigation of Flip-Chip assembly process using embedded CNT sensors – Canada
Investigation of Flip-Chip assembly process using embedded CNT sensors
The research activities of this project will be perform at the Centre de Collaboration MiQro Innovation (C2MI) in Bromont’s Industrial Park and the Interdisciplinary Institute for Technological Innovation (3IT) in Sherbrooke’s Innovation Park. The C2MI which is the largest microelectronics research centre in Canada and offers not only unique collaboration opportunities, but also exposure to world-class, and in many cases one-of-a-kind, tools to perform research and improve understanding of the packaging sciences. The C2MI currently offers equipment for the end-to-end assembly and test of advanced packaging solutions. This center offers a unique collaborative environment where students work with IBM R&D engineers to develop state of the art assembly and packaging processes. The 3IT hosts a concentration of academicals and industrial expertise at Universite de Sherbrooke (UdeS). In the 3IT, the 850 m2 clean rooms host state-of-the-art nanofabrication tools.
Subject of the project
The microelectronic packaging science and technology is a multi-disciplinary field tasked with connecting and protecting the micro-chips that we use in our everyday lives to connect to the internet, conduct bank ATM transactions or play video games. With micro-chip manufacturers finding it increasingly difficult to meet the exponential performance growth that the world has come to expect, packaging is being called upon to provide innovative, even revolutionary
solutions. Flip chip packaging dominates the field of advanced packaging but at the same time, the higher coupling of dissimilar materials inherent to the flip chip approach poses increasing thermomechanical challenges.
The objectives of this project are twofold:
1) evaluate internal stresses within and after the assembly process of the chip using embedded strain sensors based on carbon nanotubes (CNT);
2) evaluate the internal humidity level within the chip and organic substrate materials during the assembly process.
The postdoc will be involve in the design, fabrication and testing of CNT based strain and humidity sensor. In particular, the candidate will be involve in the microfabrication of test vehicle chips embedding hundreds of humidity, temperature and strain sensors. The postdoc will also be involved in the optimization of the process flow to increase
sensors performance and yield. He or she will be responsible to develop a test bench to calibrate, at the wafer level, the strains sensors.
The postdoc will closely collaborate with the research team involve in this project.
PhD in electrical or physic engineering or PhD in nanotechnologies or material science
Experimental work and clean room nanofabrication experience
Leadership, team working, communication skills
Fluent in French or English. Both is a plus.
Location: 3IT (Sherbrooke) and C2MI (Bromont), Canada;
Duration: 1 year contract renewable for a 2nd year. Starting date January 2018
Collaborations: IBM Eric Duchesne;
Scholarship: NSERC/IBM Canada Industrial Research Chair in Smarter microelectronics
Packaging for Performance Scaling
Contact: Professor D. Drouin, Dominique.Drouin@USherbrooke.ca